CALL
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Increased manufacturing susceptibility in today's nanometer
technologies requires up to date solutions for yield optimization.
In fact, designing an SoC for manufacturability and yield aims at
improving the manufacturing process and consequently its yield by
enhancing communications across the design-manufacturing interface.
A wide range of Design-for-Manufacturability (DFM) and Design-for-Yield
(DFY) methodologies and tools are proposed today. Some of which are
leveraged during the back-end design stages, and others have post-design
utilization, from lithography up to wafer sort, packaging, final test
and failure analysis. DFM and DFY can dramatically impact the business
performance of chip manufacturers. It can also significantly affect
age-old chip design flows. Using DFM and DFY solutions is an
investment and thus choosing the most cost effective one(s) requires
trade-off analysis. The workshop analyzes this key trend and its
challenges, and provides an opportunity to discuss a range of DFM
and DFY solutions for today's SoC designs. |
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Thursday -- Friday
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2:00 pm - 5:00 pm |
Registration |
4:00 pm - 5:00 pm |
Opening Session |
5:00 pm - 7:00 pm |
Session 1: DFM&Y and Test |
7:00 pm - 9:00 pm |
Evening Reception |
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7:00
am - 8:00 am |
Continental
Breakfast |
8:00
am - 10:00 am |
Session
2: Context and Perspectives on DFM&Y |
10:00
am - 10:30 am |
Break |
10:30 am - 12:30 pm |
Session 3: DFM&Y and Physical Design |
12:30 pm - 1:30 pm |
Lunch |
1:30 pm - 3:30 pm |
Session 4: Topics in DFM&Y |
3:30 pm - 5:00 pm |
Session 5: Panel - "What Will Make or Break DFM&Y" |
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WORKSHOP COMMITTEE
General Chair
Yervant Zorian
Virage Logic
Co-General Chair
Juan-Antonio Carballo
IBM
Program Chair
Andrew B. Kahng
Blaze DFM
Publication
A. Ivanov
Univ British Columbia
Panels
R. Camposano
Synopsys
Finance
R. Aitken
ARM
Publicity
D. Gizopoulos
Univ Piraeus
PROGRAM COMMITTEE
D. Appello, ST Microelectronics
C. Bittlestone, Texas Instruments
A. Gattiker, IBM
K.S. Kim, Intel
F. Kurdahi, UC Irvine
H. Lee, Magma
A. Markosian, Ponte Solutions
D. Maynard, IBM
C. Metra, Univ of Bologna
S. Muddu, UC San Diego
M. Murakata, STARC
S. Nassif, IBM
M. Nicolaidis,TIMA
N. Ns, Texas Instruments
M. Orshansky, Univ of Texas
V. Pitchumani, Intel
J.M. Portal, Univ of Marseille
P. Prinetto, Pol. di Torino
R. Radojcic, Qualcomm
J. Rey, Mentor Graphics
K. Roy, Purdue Univ
A. Singh, Auburn Univ
D. Sylvester, Univ of Michigan
V. Vardanian, Virage Logic
B. Vermeulen, Philips
D.M.H. Walker, Texas A&M Univ
S. Wigley, LTX
C-W. Wu, National Tsing Hua Univ
H-J. Wunderlich, Univ of Stuttgart
G. Yeric, Synopsys |
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Thursday -- Friday
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2:00 pm - 5:00 pm |
Registration |
4:00 pm - 5:00 pm |
Opening Session
Welcoming Remarks
General Chair Y. Zorian, Virage Logic
Program Chair A. B. Kahng, UCSD
Keynote Address
"DFM&Y: Whose Problem is it Anyway?"
N. NS, Texas Instruments |
5:00 pm - 7:00 pm |
Session 1: DFM&Y and Test
Session Chair
Andre Ivanov
Univeristy of British Columbia
1.1 Test Structures for Process and Product Performances Evaluation
Fabrice Rigaud, J.M. Portal, H. Aziza, D. Nee, J. Vast and
C. Auricchio, ST Microlelectronics, U. of Marseille
1.2 Hardware Debug Infrastructure for Soc Featuring Embedded Configurable Logic
Stefano Pucillo, Lorenzo Cali and Stefania Stucchi, STMicroelectronics
1.3 Test Chip Methods for Successful DFM
Greg Yeric, Synopsys
1.4 Accounting for Chip Yield at the Application Level
Fadi Kurdahi, Ahmed Eltawil, Kang Yi, Young-Hwan Park, Amin
Khajeh Djahromi, and Yervant Zorian, UC Irvine and Virage Logic
Wrap up Discussion |
7:00 pm - 9:00 pm |
Evening Reception |
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7:00
am - 8:00 am |
Continental
Breakfast |
8:00
am - 10:00 am |
Session
2: Context and Perspectives on DFM&Y
Session Chair
Julie Segal
Spanion
2.1 DFM: State and Directions
Sunit Rikhi, Intel
2.2 Using Test as the Ultimate Measure of DFM Effectiveness
Bob Madge, LSI Logic
2.3 Advances on Proactive DFM Experiences
David Appello, ST Microelectronics
2.4 DFM&Y Research and Development topics in STARC
Masami Murakata, STARC |
10:00
am - 10:30 am |
Break |
10:30 am - 12:30 pm |
Session 3: DFM&Y and Physical Design
Session Chair
Kazumi Hatayama
STARC
3.1 Lithography- and CMP-Aware Routing
David Pan, UT Austin
3.2 Manufacturing Models & Implementation Technology
Matt Liberty, Cadence
3.3 Manufacturability-Driven Physical Synthesis
Patrick Groeneveld, Magma
3.4 The Marriage of DFM and Physical Design: Can It Work?
Joe Hutt, Pyxis
3.5 Lithography-Aware Physical Design: Challenges and
Opportunities
Xinying Zhang, Synopsys |
12:30 pm - 1:30 pm |
Lunch |
1:30 pm - 3:30 pm |
Session 4: Topics in DFM&Y
Session Chair
Rene Segers
NXP
4.1 Simple and Accurate Models of Capacitance Increment
Due to Metal Fill, Youngmin Kim, U. Michigan
4.2 A Modeling Technique for Non-Rectangular Gates for
Static Timing Analysis
Shayak Banerjee, UT Austin
4.3 A Yield Enhancement Technique for Standard Cell
Libraries
Ara Aslyan, Ponte Solutions
4.4 Fast Dual Graph-Based Hotspot Detection
Chul-Hong Park, UC San Diego
4.5 DFM Framework for Dynamic Yield Optimization
Fedor Pikus, Mentor Graphics
4.6 Yield Prediction Using Via Distribution Model
Takumi Uezono, Tokyo Institute of Technology |
3:30 pm - 5:00 pm |
Session 5: Panel - "What Will Make or Break DFM&Y"
Co-Organized with: IEEE Design & Test of Computer
Moderator
Gary Smith
Gartner Dataquest
Panelists:
Rob Aitken, ARM
Juan-Antonio Carballo, IBM
Andrew Kahng, UC San Diego
Ara Markosian, Ponte Solutions
Masami Murakata, STARC
David Overhauser, Overhauser-Li Consultancy
David Pan, UT Austin
Yervant Zorian, Virage Logic |
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WORKSHOP LOCATION
DFM&Y 2006 will be held at Santa Clara Convention Center, Santa Clara,
California, USA, October 26 - 27, 2006, immediately following
ITC 2006 (www.itctestweek.org).
REGISTRATION
All Workshop participants require registration. Please register
using the ITC 2006 Registration Forms.
SPECIAL ISSUE
The best contributions of DFM&Y 2006 will appear in a Special Issue
of JETTA (the Journal of Electronic Testing: Theory and Applications).
INFORMATION CONTACTS
For more information on the Workshop, please contact:
Yervant ZORIAN
y.zorian@computer.org
Website
http://www.unipi.gr/dfmy
TTTC Office:
IEEE TTTC
1474 Freeman Dr
Amissville, VA 20106 USA
Tel: +1-540-937-8280
Fax: +1-540-937-7848
Email: tttc@computer.org
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The
1st IEEE International Workshop on
Design for Manufacturability & Yield (DFM&Y
2006) is sponsored by the IEEE Computer Society Test Technology Technical Council, in Cooperation with
CEDA - IEEE Council on Electronic Design Automation and in Conjunction with
Test Week / Interntional Test Conference 2006 (ITC 06).
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